AccoTEST Semiconductor ATE Systems
STAR Market: 688200 • Approaching 10,000 testers shipped globally across IDMs and OSATs.
STS8600 System-on-Chip (SoC) Test Platform
"One Platform for All" — Ultra-modern liquid-cooled test head handling complex analog and high-speed digital pins for AI processors, data center computing, automotive ECUs, and IoT chips.
STS8300 PMIC Platform
All-in-one universal test head supporting 32+ parallel sites for PMIC, Smart Power Stages (SPS), IPD, and Battery Management (BMS) with zero recurring software fees.
- • Capacity: > 500 Analog Channels directly in test head
- • Throughput: Up to 32 parallel test sites (Hard docking)
- • License Model: No annual recurring software fees
STS8200 CROSS Series
Universal power discrete and module tester for Wide Bandgap (SiC/GaN), MOSFETs, IGBTs, Known Good Die (KGD), and automotive power bricks.
- • Power Envelope: ±2000V / 600A Static, 1200V / 3000A Dynamic
- • Variants: AXE-PM (Modules), AXE-FET (Wafer), AXE-PLUS
- • Programming: Open C++ test development
Device Handling & Packaging Automation
High-speed rotary turrets, Known Good Die (KGD) handling, and intelligent leadframe trim & form systems.
Turret Test & Taping Handlers
High-speed rotary handlers integrating multi-site electrical test, 2D/3D vision check, laser marking, and automated tape & reel.
- • Speed: Up to 35,000 UPH index rate
- • Packages: QFN, DFN, SOT, SOD, SMA
- • Output: High-yield automated taping
Known Good Die (KGD) & WLBI
Precision pick-and-place bare die sorters and Wafer-Level Burn-In (WLBI) contact equipment for advanced chiplet screening.
- • Application: Bare die sort & full wafer burn-in
- • Devices: GaN, SiC, Photonics, Automotive
- • Handling: Film frame, tape, and waffle pack
Intelligent Trim, Form & Singulation
Automated high-rigidity cam-press equipment for leadframe dejunking, dambar cut, lead forming, and package singulation.
- • Mechanics: Ultra-precision cam press tooling
- • Features: Auto mold chase & strip cassettes
- • Packages: SOP, DIP, TO-220, QFP, Power
Automated Optical Inspection (AOI) Systems
In-line strip inspection, bulk component sorting, and 3D thermal warpage measurement.
Strip-to-Strip High-Speed AOI
Dual-sided automated vision inspection for leadframe strips, detecting die tilt, wire bonds, epoxy bleed, and surface defects.
- • Optics: Synchronous top & bottom high-res imaging
- • Intelligence: AI defect classification & strip mapping
Bulk Component Vision Sorter
High-throughput sorting system for loose singulated passive or active components with automated feeding and 360-degree inspection.
- • Defects: Micro-cracks, lead coplanarity, marking errors
- • Throughput: Multi-lane automated mechanical sorting
3D Thermal Warpage Metrology
Non-destructive optical measurement measuring thermo-mechanical stress and warpage deformation under real-time reflow profiles up to 300°C.
- • Scope: BGA, CSP, Flip-Chip, and multi-layer PCBs
- • Benefit: Prevents solder joint fatigue and bridging
Reliability, Burn-In & Environmental Hardware
JEDEC-compliant environmental stress fixtures and high-speed device programmers.
HAST & HTOL Reliability Boards
Custom multi-layer chamber boards for Highly Accelerated Stress Test (HAST) and High Temperature Operating Life (HTOL) screening.
- • Compliance: JEDEC JESD22-A110 & A108 standards
- • Substrates: High-Tg polyimide with burn-in sockets
ESD Test & Thermal Cycling Fixtures
Component qualification boards engineered for Electrostatic Discharge (HBM/CDM) and extreme temperature cycling (-65°C to +150°C).
- • Layout: Low parasitic inductance matched traces
- • Applications: Automotive AEC-Q100 qualification
Automated Device Programmers
In-line and offline high-throughput automated socketing equipment for flashing microcontrollers, secure memory, and automotive ECUs.
- • Protocols: JTAG, SWD, SPI, I2C, eMMC, UFS
- • Handling: Tray-to-tray and tape-to-tape options
Board-Level Support & Tester Engineering (ASL1000)
Diagnostics, resource module upgrades, and hard-to-find replacement spares.
Resource Module Conversions
Engineering conversions to increase voltage and current headroom on legacy test mainframes without capital replacement.
- • Upgrades: HVS650 → HVS850, DVI200 → DVI300, OFS
- • Spares: OEM coil transformers for HVS850 & OFS
Caldut Diagnostics & Board Repair
Component-level circuit diagnostics, calibration unit refurbishment, and root-cause repair in our local Philippine technical center.
- • Turnaround: Fast local staging to avoid line shutdown
- • Verification: Full bench qualification prior to return
Pre-Owned Mainframes & Spares
Global procurement network for verified pre-owned ASL1000 systems, test head modules, and legacy gravity handler upgrade kits.
- • Vetted: Tested and operating condition certified
- • Sourcing: Out-of-production board spares sourcing
ESD Protective Packaging, Contactors & Consumables
Antistatic carrier tapes, beryllium copper contact fingers, and ionization equipment.
ESD Packaging & Barrier Bags
Electrically conductive carrier tapes, static-dissipative top cover tapes, and Moisture Barrier Bags (MBB) for surface-mount IC shipping.
- • Materials: Conductive resin films & antistatic tapes
- • Protection: Moisture, dust, and ESD shielding
Precision Contact Fingers & Sockets
High-cycle beryllium copper (BeCu) contact fingers and custom socket blocks for rotary turret, strip, and gravity test handlers.
- • Design: Kelvin and non-Kelvin contactors
- • Durability: Extended insertion contact lifespan
Static Elimination & Thermal Greases
Industrial ionizing air blowers for line static elimination and high-thermal-conductivity Thermal Interface Materials (TIM).
- • Ionizers: High-frequency AC static eliminators
- • Thermal: High-reliability gap pads & conductive grease