Line Card 2026

Semiconductor Equipment & Production Solutions

NXTREV Technology Inc. helps Philippine semiconductor IDMs and OSATs evaluate, acquire, integrate, and support specialized production equipment with verified local follow-through.

Corporate HQ: Posadas Village, Muntinlupa City, Philippines

Direct Intake: sales@nxtrev.org

Web Portal: www.nxtrev.org

Coverage: PEZA Corridors (Laguna, Cavite, Batangas, Clark, Baguio)

Pillar 01 • Flagship Integration

Turnkey Integrated Test Cells

Single-Vendor Accountability

Complete turnkey electrical test and automated packaging cells combining the ATE tester, high-speed device handler, precision docking interface, load board, test socket, and 2D/3D optical mark check. NXTREV eliminates multi-vendor finger-pointing by managing alignment, electrical qualification, recipe creation, and local buy-off directly on your plant floor.

ATE + Handler Docking Hard docking kits, blind-mate interfaces, zero vibration coupling.

Custom Load Boards / DIBs Impedance-matched trace routing for multi-site high-speed parallel test.

Precision Sockets Kelvin contact sockets for power discretes; low-inductance elastomeric for RF.

Local Buy-Off & Ramp On-site yield verification, Gage R&R, operator training, and spares stocking.

Pillar 02 • Authorized Sales Representative

AccoTEST Semiconductor ATE

Beijing Huafeng Test & Control (STAR: 688200). 10,000 testers delivered worldwide as of October 2026.

STS8600 SoC Test Platform: > 2,000 analog channels, > 4,000 digital channels @ 1.6 Gbps, > 2,000A power delivery. Liquid-cooled test head for data centre, automotive, and IoT SoCs.

STS8300 PMIC Platform: 32-slot all-in-one test head supporting up to 32 parallel test sites. Ideal for Battery Management (BMS), Smart Power Stages (SPS), and power management ICs.

STS8200 CROSS Series (Power & GaN/SiC): Wide Bandgap (GaN/SiC), MOSFET, and IGBT tester. Up to 2000V / 2000A DC and 1200V / 18,000A short-circuit testing (AXE-PLUS), with open C++ development.

Pillar 03 • Packaging Automation

Device Handlers & Packaging Systems

High-throughput device handling, testing, sorting, and packaging automation designed for zero-jam performance and rapid package changeover.

High-Speed Rotary Turret Handlers: Up to 35,000 UPH index rate for QFN, DFN, SOT, SOD, and SMA. Multi-site test contact, laser mark, 3D lead/mark inspect, and automated tape & reel.

Strip Test & Pick-and-Place Handlers: High-density leadframe and substrate strip testing before singulation. Maximizes tester utilization on high-parallelism runs.

Known Good Die (KGD) & Bare Die Sorters: Wafer-level burn-in (WLBI) contactors, optical defect screening, and precision die sort into waffle packs or tape & reel.

Gravity-Feed Handlers & Trim & Form: Dedicated gravity handling for TO-220, DPAK, and power discretes; intelligent leadframe trim, form, and singulation tooling.

Pillar 04 • Metrology & Reliability

AOI, Metrology & Reliability Hardware

Automated Optical Inspection (AOI): Strip-to-strip automated optical inspection, post-test visual lead coplanarity check, surface crack inspection, and 3D thermography/thermal warpage measurement.

Burn-In Boards & HAST/HTOL Hardware: High-layer count High Accelerated Stress Test (HAST) boards, High Temperature Operating Life (HTOL) boards, and thermal cycling reliability hardware.

Test Sockets & Conversion Kits: Precision contact fingers, Kelvin test sockets, change kits for turret bowls, tracks, and pick heads across standard package sizes.

Pillar 05 • Sustaining Engineering

Field Service & ASL1000 Board Support

Local Commissioning & PM: Factory-certified field engineers on call for rapid installation, calibration, and emergency troubleshooting across Calabarzon and northern corridors.

Legacy ASL1000 Diagnostics & Repair: Caldut diagnostics, resource module conversions (HVS850 / DVI300), instrument board component-level repairs, and verified spare board sourcing.

Test Program Conversion: Assistance migrating legacy tester recipes (Eagle, Teradyne, Credence) to modern AccoTEST C++ architecture to reduce operational test costs.

Pillar 06 • Factory Operations Leadership

Subcontractor Management & Operations

Backed by leadership experience from Elmer Baladjay, who brings over 15 years of semiconductor Assembly & Test operations leadership from International Rectifier (now part of Infineon Technologies). NXTREV coordinates between customers, suppliers, subcontractors, and technical teams with practical factory-floor understanding.

Assembly & Final Test Ops: Factory-proven manufacturing execution.

Subcontractor Coordination: OSAT liaison and schedule governance.

Yield & Process Improvement: Root-cause analysis and defect reduction.

Capacity & Utilization: OEE optimization and line balancing.

Customer Requirement Alignment: Translating specs into factory SOPs.

Cost & Delivery Monitoring: Milestone tracking and execution control.

Pillar 07 • Supply Chain Partner

Diversified Sourcing & Supply Chain

NXTREV sources the equipment, spares, tooling and consumables a backend line runs on, from single hard-to-find parts to capital machinery, and coordinates PEZA / free-zone shipment with the customer's forwarder and broker.

Precision Spares & Machine Parts: Hard-to-find capital spares, replacement motors, vacuum generators, and custom machined tooling.

Cleanroom & ESD Consumables: Antistatic carrier tapes, cover tapes, moisture barrier bags, desiccants, and cleanroom supplies.

PEZA / Free-Zone Shipment Coordination: Import and export document coordination handled together with customer-appointed freight forwarders, couriers, and licensed customs brokers.