Production Automation

Device Handling & Packaging Automation

High-speed rotary turrets, strip test handling, Known Good Die (KGD) sorting, and leadframe trim & form.

QFN packages in carrier tape feeding onto a reel

Handler formats

Matched to your package format

Concept diagram matching four device formats to handling methods: small packaged units to a rotary turret; leadframe strips to strip test and pick-and-place; power discretes to a gravity feed tube; bare die and wafer to a KGD sorter or prober.

Turret Test & Taping Handlers

High-speed rotary handlers integrating multi-site electrical test, 2D/3D vision check, laser marking, and automated tape & reel.

Inquire Turret Handlers
Turret Test & Taping Handlers specifications
SpeedUp to 35,000 UPH index rate
PackagesQFN, DFN, SOT, SOD, SMA
OutputHigh-yield automated taping

Strip Test & Pick-and-Place

High-parallelism leadframe strip and substrate handling before package singulation, maximizing tester utilization and throughput.

Inquire Strip Handlers
Strip Test & Pick-and-Place specifications
FormatHigh-density strip & matrix
IntegrationDirect ATE docking
EfficiencyReduced index dead-time

Gravity Feed & Discrete Handlers

Proven gravity-feed systems for power discretes (TO-220, TO-247, DPAK) with high-voltage Kelvin contact isolation.

Inquire Gravity Handlers
Gravity Feed & Discrete Handlers specifications
PackagesTO-220, TO-247, D2PAK, Bridge
VoltageUp to 3,000V dielectric isolation
TrackingMulti-bin sort tubes

Known Good Die (KGD) & WLBI

Precision pick-and-place bare die sorters and Wafer-Level Burn-In (WLBI) contact equipment for advanced chiplet screening.

Inquire KGD Systems
Known Good Die (KGD) & WLBI specifications
ApplicationBare die & chiplets
Vision6-side micro-crack optical inspect
SortingGel-pak / waffle pack / tape

Need a printable overview for purchasing or engineering evaluation?

Access our consolidated 2026 Equipment & Solutions Line Card matrix in a clean, print-ready layout.