Quality Assurance & Metrology

Automated Optical Inspection (AOI)

High-speed strip-to-strip inspection, 3D lead coplanarity metrology, and thermal warpage analyzers.

Inspection targets

What each system checks

What AOI checks

Optical systems verify physical and marking defects that electrical test alone cannot catch.

Before mold (strip)Molded package

Side view, seating plane

Warpage across reflow

Marking legibility
Part number, lot, orientation.
Wire bond & epoxy
Sweep, tail, bleeding, bridging.
Surface & edge
Chipping, cracks, plating voids.
Lead coplanarity
Leads within spec height. Bent or lifted leads flagged.
3D warpage profile
Bow / twist across reflow profile. Deformation vs temperature.

Concept illustration of typical inspection targets. Actual checks depend on package and customer criteria.

High-throughput optical inspection for leadframes and substrates, identifying wire bond anomalies, epoxy bleeding, and bridging.

Inquire Strip AOI

Automatic feeding and inspection of singulated components, verifying mark legibility, lead straightness, and edge chipping.

Inquire Bulk AOI

Bulk Form & Tray Sorting AOI specifications
Throughput	High-speed optical bowl feed
Rejection	Real-time laser or pneumatic binning
Reports	Automated SPC yield tracking

Dynamic optical profilometry measuring substrate warpage and coplanarity across simulated reflow temperature profiles.

Inquire Metrology

3D Thermography & Warpage specifications
Temp Range	Room temp up to +350°C
Standards	JEDEC reflow compliance
Output	3D surface topography heatmaps

Access our consolidated 2026 Equipment & Solutions Line Card matrix in a clean, print-ready layout.